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INTEGRATED CIRCUITS
DATA SHEET
74AVC16245 16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
Product specification Supersedes data of 1998 Dec 11 File under Integrated Circuits, IC24 1999 Nov 15
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
FEATURES * Wide supply voltage range from 1.2 to 3.6 V * Complies with JEDEC standard no. 8-1A/5/7 * CMOS low power consumption * Input/output tolerant up to 3.6 V * Dynamic Controlled Output (DCO) circuit dynamically changes output impedance, resulting in noise reduction without speed degradation * Low inductance multiple power and ground pins for minimum noise and ground bounce * Power off disables outputs, permitting live insertion. DESCRIPTION
74AVC16245
The 74AVC16245 is a 16-bit transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The 74AVC16245 features two output enable inputs (nOE) for easy cascading and two send/receive inputs (nDIR) for direction control. Input nOE controls the outputs so that the buses are effectively isolated. This device can be used as two 8-bit transceivers or one 16-bit transceiver. This product is designed to have an extremely fast propagation delay and a minimum amount of power consumption. To ensure the high-impedance output state during power-up or power-down, input nOE should be tied to VCC through a pull-up resistor (live insertion). A DCO circuitry is implemented to support termination line drive during transient (see Figs 1 and 2).
MNA506
handbook, halfpage
0
MNA507
handbook, halfpage
300
I OH (mA) 1.8 V -100
I OL (mA) 200 2.5 V 2.5 V
3.3 V
-200
100
1.8 V
3.3 V -300 0 0 1 2 3 VOH (V) 4 0 1 2 3 VOL (V) 4
Fig.1 Output current as function of output voltage.
Fig.2 Output current as function of output voltage.
1999 Nov 15
2
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.0 ns; CL = 30 pF. SYMBOL tPHL/tPLH PARAMETER propagation delay nAn to nBn; nBn to nAn CONDITIONS VCC = 1.2 V VCC = 1.5 V VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V CI CPD input capacitance power dissipation capacitance per buffer notes 1 and 2 outputs enabled outputs disabled Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; (CL x VCC2 x fo) = sum of outputs. 2. The condition is VI = GND to VCC. FUNCTION TABLE See note 1. INPUTS nOE L L H Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high-impedance OFF-state. nDIR L H X nAn A=B inputs Z 42 2 2.8 1.8 1.8 1.3 1.1 5.0
74AVC16245
TYP. ns ns ns ns ns pF pF pF
UNIT
INPUTS/OUTPUTS nBn inputs B=A Z
1999 Nov 15
3
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE 74AVC16245DGG PINNING PIN 1 2, 3, 5, 6, 8, 9, 11 and 12 4, 10, 15, 21, 28, 34, 39 and 45 7, 18, 31 and 42 13, 14, 16, 17, 19, 20, 22 and 23 24 25 26, 27, 29, 30, 32, 33, 35 and 36 37, 38, 40, 41, 43, 44, 46 and 47 48 SYMBOL 1DIR 1B0 to 1B7 GND VCC 2B0 to 2B7 2DIR 2OE 2A7 to 2A0 1A7 to 1A0 1OE direction control data inputs/outputs ground (0 V) DC supply voltage data inputs/outputs direction control -40 to +85 C PINS 48 PACKAGE TSSOP
74AVC16245
MATERIAL plastic
CODE SOT362-1
DESCRIPTION
output enable input (active LOW) data inputs/outputs data inputs/outputs output enable input (active LOW)
1999 Nov 15
4
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
74AVC16245
handbook, halfpage
1DIR 1B0 1B1 GND 1B2 1B3 VCC 1B4 1B5
1 2 3 4 5 6 7 8 9
48 1OE 47 1A0 46 1A1 45 GND 44 1A2 43 1A3 42 VCC 41 1A4 40 1A5 39 GND 38 1A6 1A1 1A2 1A3 1A4 1A5 1A6 1A7 2A0 46 44 43 41 40 38 37 36 4 5 1A0 47 1 2 3 5 6 8 9 11 12 13 1B1 1B2 1B3 1B4 1B5 1B6 1B7 2B0 2 1B0 48 1OE 1 1DIR 25 2OE 24 2DIR G3 3EN1[BA] 3EN2[AB] G6 6EN1[BA] 6EN2[AB]
GND 10 1B6 11 1B7 12 2B0 13 2B1 14 GND 15 2B2 16 2B3 17 VCC 18 2B4 19 2B5 20 GND 21 2B6 22 2B7 23 2DIR 24
MNA508
16245
37 1A7 36 2A0 35 2A1 34 GND 33 2A2 32 2A3 31 VCC 30 2A4 29 2A5 28 GND 27 2A6 26 2A7 25 2OE
2A1 2A2 2A3 2A4 2A5 2A6 2A7
35 33 32 30 29 27 26
14 16 17 19 20 22 23
2B1 2B2 2B3 2B4 2B5 2B6 2B7
MNA003
Fig.3 Pin configuration.
Fig.4 IEEE/IEC logic symbol.
1999 Nov 15
5
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
74AVC16245
handbook, full pagewidth
1
1DIR 1OE
24 48 36 1B0 2 35 1B1 3 33 1B2 5 32 1B3 6 30 1B4 8 29 1B5 9 27 1B6 11 26 1B7 12
2DIR 2OE 2A0 2B0 2A1 2B1 2A2 2B2 2A3 2B3 2A4 2B4 2A5 2B5 2A6 2B6 2A7 2B7 23 22 20 19 17 16 14 13
25
47
1A0
46
1A1
44
1A2
43
1A3
41
1A4
40
1A5
38
1A6
37
1A7
MNA509
Fig.5 Logic symbol.
1999 Nov 15
6
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER DC supply voltage CONDITIONS according JEDEC low-voltage standards MIN. 1.65 2.3 3.0 low-voltage applications VI VO Tamb tr, tf DC input voltage DC output voltage operating ambient temperature input rise and fall times 3-state HIGH or LOW state in free air VCC = 1.65 to 2.3 V VCC = 2.3 to 3.0 V VCC = 3.0 to 3.6 V 1.2 0 0 0 -40 0 0 0
74AVC16245
MAX. 1.95 2.7 3.6 3.6 3.6 3.6 VCC +85 30 20 10
UNIT V V V V V V V C ns/V ns/V ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO IO ICC,IGND Tstg Ptot Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 60 C the value of PD derates linearly with 5.5 mW/K. PARAMETER DC supply voltage DC input diode current DC input voltage DC output diode current DC output voltage DC output source or sink current DC VCC or GND current storage temperature power dissipation per package temperature range from -40 to +85 C; note 2 VI < 0 V for inputs; note 1 VO > VCC or VO < 0 V HIGH or LOW state; note 1 3-state; note 1 VO = 0 V to VCC CONDITIONS - -0.5 - -0.5 -0.5 - - -65 - MIN. -0.5 MAX. +4.6 -50 +4.6 50 VCC + 0.5 +4.6 50 100 +150 500 UNIT V mA V mA V V mA mA C mW
1999 Nov 15
7
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
DC CHARACTERISTICS Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL VIH PARAMETER OTHER HIGH-level input voltage VCC (V) 1.2 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 VIL LOW-level input voltage 1.2 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 VOH HIGH-level output voltage VI = VIH or VIL IO = -100 A IO = -4 mA IO = -8 mA IO = -12 mA VOL LOW-level output voltage VI = VIH or VIL IO = 100 A IO = 4 mA IO = 8 mA IO = 12 mA II Ioff IIHZ/IILZ IOZ ICC input leakage current per pin power off leakage current input current for common I/O pins 3-state output OFF-state current quiescent supply current VI = VCC or GND VI or VO = 3.6 VI = VCC or GND VI = VIH or VIL; VO = VCC or GND VI = VCC or GND; IO = 0 1.65 to 3.6 1.65 2.3 3.0 1.65 to 3.6 0 1.65 to 3.6 1.65 to 2.7 3.0 to 3.6 1.65 to 2.7 3.0 to 3.6 - - - - - - - - - - - GND 0.10 0.26 0.36 0.1 0.1 0.1 0.1 0.1 0.1 0.2 1.65 to 3.6 1.65 2.3 3.0 VCC - 0.20 VCC - 0.45 VCC - 0.55 VCC - 0.70 VCC VCC 0.65VCC 1.7 2.0 - - - -
74AVC16245
Tamb = -40 to +85 C MIN. - 0.9 1.2 1.5 - 0.9 1.2 1.5 TYP.(1) - - - - GND 0.7 0.8 - - - - 0.20 0.45 0.55 0.70 2.5 10 12.5 5 10 20 40 MAX.
UNIT V V V V V V V V V V V V V V V A A A A A A A
0.35VCC V
VCC - 0.10 VCC - 0.28 VCC - 0.32
Note 1. All typical values are measured at Tamb = 25 C.
1999 Nov 15
8
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
AC CHARACTERISTICS GND = 0 V; tr = tf 2.0 ns; CL = 30 pF. TEST CONDITIONS SYMBOL tPHL/tPLH PARAMETER WAVEFORMS propagation delay nAn to nBn; nBn to nAn see Figs 6 and 8 VCC (V) 1.2 -
74AVC16245
Tamb = -40 to +85 C MIN. TYP.(1) 2.8 1.8 1.8 1.3 1.1 5.9 3.9 3.3 2.4 2.0 6.9 4.8 3.7 2.0 2.2 MAX. - - 3.0 1.9 1.7 - - 6.5 4.5 3.7 - - 6.0 4.2 3.7
UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
1.40 to 1.60 - 1.65 to 1.95 0.7 2.3 to 2.7 3.0 to 3.6 0.6 0.5 -
tPZH/tPZL
3-state output enable time nOE to nAn; nOE to nBn
see Figs 7 and 8
1.2
1.40 to 1.60 - 1.65 to 1.95 1.4 2.3 to 2.7 3.0 to 3.6 1.0 0.7 -
tPHZ/tPLZ
3-state output disable time nOE to nAn; nOE to nBn
see Figs 7 and 8
1.2
1.40 to 1.60 - 1.65 to 1.95 2.2 2.3 to 2.7 3.0 to 3.6 1.1 1.2
Note 1. All typical values are measured at Tamb = 25 C and at VCC = 1.2 V, 1.5 V, 1.8 V, 2.5 V or 3.3 V. AC WAVEFORMS
handbook, halfpage VI
nAn, nBn input GND
VM
t PHL VOH nBn, nAn output VOL VM
t PLH
MNA511
VCC 2.3 to 2.7 V 3.0 to 3.6 V
VM 0.5VCC 0.5VCC
VI VCC VCC
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.6 The input (nAn, nBn) to output (nBn, nAn) propagation delay.
1999 Nov 15
9
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
74AVC16245
handbook, full pagewidth
VI nOE input GND t PLZ VCC output LOW-to-OFF OFF-to-LOW VOL t PHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled VY VM VM VX t PZH t PZL VM
outputs disabled
outputs enabled
MNA478
VCC 2.3 to 2.7 V 3.0 to 3.6 V
VM 0.5VCC 0.5VCC
VX VOL + 0.15 V VOL + 0.3 V
VY VOH - 0.3 V
VI VCC
VOH - 0.15 V VCC
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.7 The 3-state enable and disable times.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL R load VO R load
2 x VCC open GND
MNA505
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH
S1 open 2 x VCC GND
VCC <2.3 V
VI VCC
Rload 1000 500 500
Definitions for test circuit. CL = load capacitance including jig and probe capacitance (See Chapter "AC characteristics"). RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
2.3 to 2.7 V VCC 3.0 to 3.6 V VCC
Fig.8 Load circuitry for switching times. Fig.8 Test circuitry for switching times.
1999 Nov 15
10
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
PACKAGE OUTLINE TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
74AVC16245
SOT362-1
D
E
A X
c y HE vMA
Z
48
25
Q A2 A1 pin 1 index Lp L (A 3) A
1
e bp
24
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions). UNIT mm A max. 1.2 A1 0.15 0.05 A2 1.05 0.85 A3 0.25 bp 0.28 0.17 c 0.2 0.1 D (1) 12.6 12.4 E (2) 6.2 6.0 e 0.5 HE 8.3 7.9 L 1 Lp 0.8 0.4 Q 0.50 0.35 v 0.25 w 0.08 y 0.1 Z 0.8 0.4 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 REFERENCES IEC JEDEC MO-153ED EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-02-03 95-02-10
1999 Nov 15
11
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
74AVC16245
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Nov 15
12
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
Suitability of surface mount IC packages for wave and reflow soldering methods
74AVC16245
SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
1999 Nov 15
13
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
NOTES
74AVC16245
1999 Nov 15
14
Philips Semiconductors
Product specification
16-bit transceiver with direction pin; 3-state (3.6 V tolerant)
NOTES
74AVC16245
1999 Nov 15
15
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/02/pp16
Date of release: 1999
Nov 15
Document order number:
9397 750 06481

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